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High-temperature insulators, boron nitride, furnace construction, PVD systems, surface technology

MYCROSINT® BORON NITRIDE (BN) HIGH-TEMPERATURE INSULATORS FOR FURNACE CONSTRUCTION, PVD SYSTEMS, SURFACE TECHNOLOGY

The functionalization of the surface of materials has gained ever increasing importance in recent years. An extremely varied range of coating technologies is now available.

MYCROSINT® – Insulation under Extreme Conditions

The technique now mainly used to apply abrasion-resistant, optical or decorative coatings to metal, glass or polymer substrates is physical vapor deposition (PVD), which offers a diverse range of applications and good environmental compatibility.

The substances to be coated are converted into the vapor phase at between 500°C and 1500°C, and then deposited on the lower temperature substrate. These processes require insulation materials such as ESK’s MYCROSINT® boron nitride ceramic, which provides assured electrical insulation even under the most severe conditions. Furthermore, it is easy to remove any deposits on insulators resulting from the application process.

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Boron Nitride
Material properties Norm Symbol / Unit MYCROSINT®
HD		 MYCROSINT®
S		 MYCROSINT®
CD
Crystalline phases hex. BN hex. BN hex. BN
Binder phase / Binder type <1%B2O3 4%B2O3 B2O3 + CaO
Orientation dependency Isotropic Anisotropic Anisotropic
⊥ II ⊥ II
Density (typical) DIN EN 623-2 ρ [g/cm3] 1.96 2.07 2.07 1.97 1.97
Total porosity (calculated using theoretical density) DIN EN 623-2 P [%] <13 <7 <7 <12 <12
Brinell hardness DIN EN
ISO 6506-1		 HBW
2.5/31.25		 10 30 30 13 13
Young’s modulus DIN EN 843-2 E [GPa] 23 35 30 30 25
Flexural strength DIN EN 843-1 σB [MPa] 19 95 85 40 35
Weibull modulus DIN EN 843-1
Compressive strength AAW/
AC-R-302-03		 σD [MPa] 36 105 125 50 55
Coefficient of thermal expansion DIN EN 821-1 Thermal expansion behavior: nonlinear, residual elonation after cooling; CTE given indication only
20°C - 500°C α [10-6/K] -1 1 2 -1 -1
500°C - 1000°C α [10-6/K] 0.5 1 2 1.5 2
1000°C - 1500°C α [10-6/K] 2.5 1 5 3 4
Specific heat at 20°C DIN EN 821-3 Cp [J/gK] 0.61 0.6 0.6 0.58 0.58
Thermal conductivity at 20°C DIN EN 821-2 λ [W/mK] 25 40 25 35 35
Maximum temperature of use (oxidizing/inert atmosphere) [°C] 900/1800 1000/
1500		 1000/
1500		 1100/
1500		 1100/
1500
Specific electrical resistance at 20°C DIN EN 50359 ρ [Ωcm] >1012 >1012 >1012 >1012 >1012



Boron Nitride
Material properties Norm Symbol / Unit MYCROSINT®
SO20		 MYCROSINT®
SO43		 MYCROSINT®
O40
Crystalline phases BN+ZrO2+SiC BN+ZrO2+SiC BN+ZrO2
Binder phase / Binder type 2%B2O3
Orientation dependency Anisotropic Anisotropic Anisotropic
⊥ II ⊥ II ⊥ II
Density (typical) DIN EN 623-2 ρ [g/cm3] 2.3 2.3 2.92 2.92 2.82 2.82
Total porosity (calculated using theoretical density) DIN EN 623-2 P [%] 10 10 <6 <6 <6 <6
Brinell hardness DIN EN
ISO 6506-1		 HBW
2.5/31.25		 30 30 85 85 63 63
Young’s modulus DIN EN 843-2 E [GPa] 35 20 45 30 45 25
Flexural strength DIN EN 843-1 σB [MPa] 70 40 120 80 120 80
Weibull modulus DIN EN 843-1
Compressive strength AAW/
AC-R-302-03		 σD [MPa] 85 100 175 175 185 185
Coefficient of thermal expansion DIN EN 821-1 Thermal expansion behavior: nonlinear, residual elonation after cooling; CTE given indication only
20°C - 500°C α [10-6/K] 0.5 4.6 2 8 2 6
500°C - 1000°C α [10-6/K] 1.9 6.6 4 9 3.5 9
1000°C - 1500°C α [10-6/K] 0.5 2.2 1.4 4.5 1.5 8
Specific heat at 20°C DIN EN 821-3 Cp [J/gK] 0.6 0.6 0.5 0.5 0.5 0.5
Thermal conductivity at 20°C DIN EN 821-2 λ [W/mK] 45 25 40 30 30 20
Maximum temperature of use (oxidizing/inert atmosphere) [°C] 1100/
1800		 1100/
1800		 1100/
1800		 1100/
1800		 1100/
1800		 1100/
1800
Specific electrical resistance at 20°C DIN EN 50359 ρ [Ωcm] >1012 >1012 >1012 >1012 >1012 >1012