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BORON NITRIDE LABORATORY CRUCIBLES

MYCROSINT® BORON NITRIDE (BN) LABORATORY CRUCIBLES

Continuous monitoring and analysis of metallurgical processes requires precise and fail-proof instrumentation and evaluation methods. To ensure a product of constant quality and minimize rejects, it is essential to determine the melt purity by analyzing samples.

Analysis crucibles of ESK’s MYCROSINT® boron nitride ceramic are the preferred materials for analysis of almost all molten metals. The fact that they are not wetted, and their low chemical reactivity almost entirely eliminates contamination of the material under analysis.

Because MYCROSINT® materials feature excellent thermal shock resistance, the sample material can usually be taken directly from the melt.

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Boron Nitride
Material properties Norm Symbol / Unit MYCROSINT®
HD		 MYCROSINT®
S		 MYCROSINT®
CD
Crystalline phases hex. BN hex. BN hex. BN
Binder phase / Binder type <1%B2O3 4%B2O3 B2O3 + CaO
Orientation dependency Isotropic Anisotropic Anisotropic
⊥ II ⊥ II
Density (typical) DIN EN 623-2 ρ [g/cm3] 1.96 2.07 2.07 1.97 1.97
Total porosity (calculated using theoretical density) DIN EN 623-2 P [%] <13 <7 <7 <12 <12
Brinell hardness DIN EN
ISO 6506-1		 HBW
2.5/31.25		 10 30 30 13 13
Young’s modulus DIN EN 843-2 E [GPa] 23 35 30 30 25
Flexural strength DIN EN 843-1 σB [MPa] 19 95 85 40 35
Weibull modulus DIN EN 843-1
Compressive strength AAW/
AC-R-302-03		 σD [MPa] 36 105 125 50 55
Coefficient of thermal expansion DIN EN 821-1 Thermal expansion behavior: nonlinear, residual elonation after cooling; CTE given indication only
20°C - 500°C α [10-6/K] -1 1 2 -1 -1
500°C - 1000°C α [10-6/K] 0.5 1 2 1.5 2
1000°C - 1500°C α [10-6/K] 2.5 1 5 3 4
Specific heat at 20°C DIN EN 821-3 Cp [J/gK] 0.61 0.6 0.6 0.58 0.58
Thermal conductivity at 20°C DIN EN 821-2 λ [W/mK] 25 40 25 35 35
Maximum temperature of use (oxidizing/inert atmosphere) [°C] 900/1800 1000/
1500		 1000/
1500		 1100/
1500		 1100/
1500
Specific electrical resistance at 20°C DIN EN 50359 ρ [Ωcm] >1012 >1012 >1012 >1012 >1012



Boron Nitride
Material properties Norm Symbol / Unit MYCROSINT®
SO20		 MYCROSINT®
SO43		 MYCROSINT®
O40
Crystalline phases BN+ZrO2+SiC BN+ZrO2+SiC BN+ZrO2
Binder phase / Binder type 2%B2O3
Orientation dependency Anisotropic Anisotropic Anisotropic
⊥ II ⊥ II ⊥ II
Density (typical) DIN EN 623-2 ρ [g/cm3] 2.3 2.3 2.92 2.92 2.82 2.82
Total porosity (calculated using theoretical density) DIN EN 623-2 P [%] 10 10 <6 <6 <6 <6
Brinell hardness DIN EN
ISO 6506-1		 HBW
2.5/31.25		 30 30 85 85 63 63
Young’s modulus DIN EN 843-2 E [GPa] 35 20 45 30 45 25
Flexural strength DIN EN 843-1 σB [MPa] 70 40 120 80 120 80
Weibull modulus DIN EN 843-1
Compressive strength AAW/
AC-R-302-03		 σD [MPa] 85 100 175 175 185 185
Coefficient of thermal expansion DIN EN 821-1 Thermal expansion behavior: nonlinear, residual elonation after cooling; CTE given indication only
20°C - 500°C α [10-6/K] 0.5 4.6 2 8 2 6
500°C - 1000°C α [10-6/K] 1.9 6.6 4 9 3.5 9
1000°C - 1500°C α [10-6/K] 0.5 2.2 1.4 4.5 1.5 8
Specific heat at 20°C DIN EN 821-3 Cp [J/gK] 0.6 0.6 0.5 0.5 0.5 0.5
Thermal conductivity at 20°C DIN EN 821-2 λ [W/mK] 45 25 40 30 30 20
Maximum temperature of use (oxidizing/inert atmosphere) [°C] 1100/
1800		 1100/
1800		 1100/
1800		 1100/
1800		 1100/
1800		 1100/
1800
Specific electrical resistance at 20°C DIN EN 50359 ρ [Ωcm] >1012 >1012 >1012 >1012 >1012 >1012