BORONID® BORON NITRIDE (BN) FILLER FOR THERMAL CONDUCTIVE POLYMERS
Ongoing miniaturization of electronic components requires materials that can quickly and effectively dissipate heat within an extremely small space. Highly thermally conductive polymers are used for applications involving the transfer, propagation or dissipation of thermal energy. Modern thermal management composites offer extremely good thermal conductivity while retaining the typical properties of plastics such as electrical insulation and low weight.
Applications and Properties
BORONID®, boron nitride powders, from ESK are available for tailored solutions in many application areas. For example, BORONID® BN powders are ideal fillers for improving the thermal conductivity of polymers. They are also characterized by a unique combination of application properties.
- High thermal conductivity
- Low dielectric constant
- Excellent electrical insulation properties
- High abrasion resistance
- No toxicity
- Good heat resistance
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