COMPONENTS FOR CHEMICAL PLANT ENGINEERING, SPECIFICALLY FITTINGS, METERING SYSTEMS, PROCESS ENGINEERING
Chemical plant engineering requires a variety of specialized product solutions. Our EKasic® silicon carbide and EKasin® silicon nitride products are used for, e.g., for fittings and dosing systems, or in process engineering. They also have a proven track record as components for valve manufacture. They are produced exclusively to customers’ specifications, and an extremely wide variety of shapes and geometries are available.
Product Solutions and Applications
To reduce wear in parts subject to abrasion and corrosion, even at high temperatures, we have developed non-oxide ceramics with special properties. We also produce other product solutions tailored to particular industrial conditions (e.g. temperature, medium, solids content, flow rate, viscosity), such as the following chemical plant components:
- Fitting components
- Valve components, valve parts, valve cylinders, valve seats
- Balls with/without a through bore, ball joints, ball-bearing seats
- Disk valves, flow valves
- Actuator parts
- Wear protection tubes
Materials Used
For such components, our industrially proven materials EKasic® silicon carbide and EKasin® silicon nitride offer custom solutions:
- EKasin® silicon nitride
the high-toughness solution - EKasic® T silicon carbide
the solution for good toughness and high hardness - EKasic® F silicon carbide
the very hard standard material with very good corrosion resistance - EKasic® F plus silicone carbide
the solution with high strength with low porosity and excellent corrosion resistance
| Silicon Carbide | |||||
| Material properties | Norm | Symbol/Unit | EKasic® F |
EKasic® F plus |
EKasic® T |
| Density | DIN EN 623-2 | ρ [g/cm3] | >3.10 | >3.16 | >3.21 |
| Porosity | DIN EN 623-2 | P [%] | <3.0 | <1.0 | <1.0 |
| Mean grain size | [μm] | <5 | <5 | <2 | |
| Grain size distribution | [μm] | ||||
| Phase composition | α-SiC | α-SiC | α-SiC, YAG |
||
| Vickers hardness | DIN EN 843-4 | HV 1 [GPa] | 25.5 | 25.5 | 22.5 |
| Knoop hardness | DIN EN 843-4 | HK 0.1 [GPa] | 24.5 | 24.5 | 21.0 |
| Young's modulus | DIN EN 843-2 | E [GPa] | 410 | 420 | 420 |
| Weibull modulus | DIN EN 843-5 | m | 10 | 15 | 15 |
| Flexural strength, 4-pt bending |
DIN EN 843-1 | σB [MPa] | 400 | 510 | 550 |
| Compressive strength | σD [MPa] | 2200 | 2200 | 2500 | |
| Poisson ratio | ν | 0.17 | 0.17 | 0.16 | |
| Fracture toughness (SENB) |
Klc [MPa·m0,5] | 4 | 4 | 6 | |
| Coefficient of thermal expansion |
DIN EN 821-1 | ||||
| 20°C - 500°C | α [10-6/K] | 4.1 | 4.1 | 3.5 | |
| 500°C - 1000°C | α [10-6/K] | 5.2 | 5.2 | 5.2 | |
| Specific heat at 20°C | DIN EN 821-3 | cp [J/g K] | 0.6 | 0.6 | 0.6 |
| Thermal conductivity at 20°C |
DIN EN 821-2 | λ [W/mK] | 125 | 125 | 75 |
| Thermal stress parameters |
calculated | ||||
| R1 = σB·(1-ν) / (α·E) | R1 [K] | 198 | 246 | 314 | |
| R2 = R1·λ | R2 [W/mm] | 25 | 31 | 24 | |
| Specific electrical resistance at 20°C |
DIN EN 50359 | ρ [Ω cm] | 106-108 | 106-108 | 102-103 |
| Silicon Carbide | |||||
| Material properties | Norm | Symbol/Unit | EKasic® C |
EKasic® P |
EKasic® G |
| Density | DIN EN 623-2 | ρ [g/cm3] | >3.10 | >2.76- 2.89 |
>3.02 |
| Porosity | DIN EN 623-2 | P [%] | <3.0 | 10-14 | <3.0 |
| Mean grain size | [μm] | bimodal | <5 | bimodal | |
| Grain size distribution | [μm] | 10-1500 | 10-1000 | ||
| Phase composition | α-SiC | α-SiC | α-SiC, graphite |
||
| Vickers hardness | DIN EN 843-4 | HV 1 [GPa] | 25.5 | 23.5 | 24.5 |
| Knoop hardness | DIN EN 843-4 | HK 0.1 [GPa] | 24.5 | 21.6 | 23.0 |
| Young's modulus | DIN EN 843-2 | E [GPa] | 410 | 340 | 390 |
| Weibull modulus | DIN EN 843-5 | m | 10 | 15 | 14 |
| Flexural strength, 4-pt bending |
DIN EN 843-1 | σB [MPa] | 400 | 225 | 230 |
| Compressive strength | σD [MPa] | 2500 | 2000 | 2500 | |
| Poisson ratio | ν | 0.17 | 0.17 | 0.16 | |
| Fracture toughness (SENB) |
Klc [MPa·m0,5] | 3.5 | 3 | 3 | |
| Coefficient of thermal expansion |
DIN EN 821-1 | ||||
| 20°C - 500°C | α [10-6/K] | 4.1 | 3.5 | 4.0 | |
| 500°C - 1000°C | α [10-6/K] | 5.2 | 5.6 | 5.0 | |
| Specific heat at 20°C | DIN EN 821-3 | cp [J/g K] | 0.6 | 0.6 | 0.6 |
| Thermal conductivity at 20°C |
DIN EN 821-2 | λ [W/mK] | 125 | 90 | 110 |
| Thermal stress parameters |
calculated | ||||
| R1 = σB·(1-ν) / (α·E) | R1 [K] | 198 | 157 | 124 | |
| R2 = R1·λ | R2 [W/mm] | 25 | 14 | 14 | |
| Specific electrical resistance at 20°C |
DIN EN 50359 | ρ [Ω cm] | 103-104 | 106-108 | 103-104 |
| Silicon Nitride | |||
| Material properties | Norm | Symbol/Unit | Ekasin®S |
| Density | DIN EN 623-2 | ρ [g/cm3] | >3.24 |
| Porosity | DIN EN 623-2 | P [%] | <0.5 |
| Mean grain size | [μm] | <2 | |
| Aspect ratio (L/D) | 3-5 | ||
| Phase composition | β-Si3N4, Oxide | ||
| Vickers hardness | DIN EN 843-4 | HV 1 [GPa] | 14 |
| Knoop hardness | DIN EN 843-4 | HK 0.1 [GPa] | 13.5 |
| Young's modulus | DIN EN 843-2 | E [GPa] | 300 |
| Weibull modulus | DIN EN 843-5 | m | 15 |
| Flexural strength, 4-pt bending | DIN EN 843-1 | σB [MPa] | 700 |
| Compressive strength | σD [MPa] | >2500 | |
| Poisson ratio | ν | 0.25 | |
| Fracture toughness (SENB) | Klc [MPa·m0,5] | 7 | |
| Coefficient of thermal expansion | DIN EN 821-1 | ||
| 20°C - 500°C | α [10-6/K] | 2.0 | |
| 500°C - 1000°C | α [10-6/K] | 4.0 | |
| Specific heat at 20°C | DIN EN 821-3 | cp [J/g K] | 0.7 |
| Thermal conductivity at 20°C | DIN EN 821-2 | λ [W/m K] | 25 |
| Thermal stress parameters | calculated | ||
| R1 = σB·(1-ν) / (α·E) | [K] | 875 | |
| R2 = R1·λ | [W/mm] | 22 | |
| Specific electrical resistance at 20°C |
ρ [Ω cm] | >1011 | |
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