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EKasic® SILICON CARBIDE AND EKasin® SILICON NITRIDE GAS SEAL RINGS

EKasic® SILICON CARBIDE AND EKasin® SILICON NITRIDE GAS SEAL RINGS

For sealing compressors, gas-lubricated mechanical seals have proven to be the most economical solution. They operate on the basis of the contact-free relative movement of the rotor and stator at extremely high speeds and with a minimum gap size. Microstructures introduced into the running surface provide the “air cushion” that allows contact-free rotation. The crucial advantages are no maintenance and minimum leakage:

For this application, ESK offers EKasic® silicon carbide (SiC) or EKasin® silicon nitride (Si3N4) gas seal rings for use in gas-lubricated mechanical seals.

EKasic® T Gas Seal Rings

 

EKasic® T gas seal rings from ESK offer an impressive combination of properties:

  • High mechanical strength
  • Excellent thermal conductivity
  • High stiffness
  • Corrosion resistance

EKasin® Gas Seal Rings

Special high-performance applications can be implemented with the use of EKasin® S (silicon nitride) for the gas seal rings from ESK.

Custom Modifications

As additional services, ESK can microstructure the gas seal rings and perform DLC coating for the start-up phase to customer specifications.

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Silicon Carbide
Material properties Norm Symbol/Unit EKasic®
F
EKasic®
F plus
EKasic®
T
Density DIN EN 623-2 ρ [g/cm3] >3.10 >3.16 >3.21
Porosity DIN EN 623-2 P [%] <3.0 <1.0 <1.0
Mean grain size [μm] <5 <5 <2
Grain size distribution [μm]
Phase composition α-SiC α-SiC α-SiC,
YAG
Vickers hardness DIN EN 843-4 HV 1 [GPa] 25.5 25.5 22.5
Knoop hardness DIN EN 843-4 HK 0.1 [GPa] 24.5 24.5 21.0
Young's modulus DIN EN 843-2 E [GPa] 410 420 420
Weibull modulus DIN EN 843-5 m 10 15 15
Flexural strength,
4-pt bending
DIN EN 843-1 σB [MPa] 400 510 550
Compressive strength σD [MPa] 2200 2200 2500
Poisson ratio ν 0.17 0.17 0.16
Fracture toughness
(SENB)
Klc [MPa·m0,5] 4 4 6
Coefficient of
thermal expansion
DIN EN 821-1
20°C - 500°C α [10-6/K] 4.1 4.1 3.5
500°C - 1000°C α [10-6/K] 5.2 5.2 5.2
Specific heat at 20°C DIN EN 821-3 cp [J/g K] 0.6 0.6 0.6
Thermal conductivity
at 20°C
DIN EN 821-2 λ [W/mK] 125 125 75
Thermal stress
parameters
calculated
R1 = σB·(1-ν) / (α·E) R1 [K] 198 246 314
R2 = R1·λ R2 [W/mm] 25 31 24
Specific electrical
resistance at 20°C
DIN EN 50359 ρ [Ω cm] 106-108 106-108 102-103



Silicon Carbide
Material properties Norm Symbol/Unit EKasic®
C
EKasic®
P
EKasic®
G
Density DIN EN 623-2 ρ [g/cm3] >3.10 >2.76-
2.89
>3.02
Porosity DIN EN 623-2 P [%] <3.0 10-14 <3.0
Mean grain size [μm] bimodal <5 bimodal
Grain size distribution [μm] 10-1500 10-1000
Phase composition α-SiC α-SiC α-SiC,
graphite
Vickers hardness DIN EN 843-4 HV 1 [GPa] 25.5 23.5 24.5
Knoop hardness DIN EN 843-4 HK 0.1 [GPa] 24.5 21.6 23.0
Young's modulus DIN EN 843-2 E [GPa] 410 340 390
Weibull modulus DIN EN 843-5 m 10 15 14
Flexural strength,
4-pt bending
DIN EN 843-1 σB [MPa] 400 225 230
Compressive strength σD [MPa] 2500 2000 2500
Poisson ratio ν 0.17 0.17 0.16
Fracture toughness
(SENB)
Klc [MPa·m0,5] 3.5 3 3
Coefficient of
thermal expansion
DIN EN 821-1
20°C - 500°C α [10-6/K] 4.1 3.5 4.0
500°C - 1000°C α [10-6/K] 5.2 5.6 5.0
Specific heat at 20°C DIN EN 821-3 cp [J/g K] 0.6 0.6 0.6
Thermal conductivity
at 20°C
DIN EN 821-2 λ [W/mK] 125 90 110
Thermal stress
parameters
calculated
R1 = σB·(1-ν) / (α·E) R1 [K] 198 157 124
R2 = R1·λ R2 [W/mm] 25 14 14
Specific electrical
resistance at 20°C
DIN EN 50359 ρ [Ω cm] 103-104 106-108 103-104
fileadmin/esk/plain/ekasin_s-e.html

Silicon Nitride
Material properties Norm Symbol/Unit Ekasin®S
Density DIN EN 623-2 ρ [g/cm3] >3.24
Porosity DIN EN 623-2 P [%] <0.5
Mean grain size [μm] <2
Aspect ratio (L/D) 3-5
Phase composition β-Si3N4, Oxide
Vickers hardness DIN EN 843-4 HV 1 [GPa] 14
Knoop hardness DIN EN 843-4 HK 0.1 [GPa] 13.5
Young's modulus DIN EN 843-2 E [GPa] 300
Weibull modulus DIN EN 843-5 m 15
Flexural strength, 4-pt bending DIN EN 843-1 σB [MPa] 700
Compressive strength σD [MPa] >2500
Poisson ratio ν 0.25
Fracture toughness (SENB) Klc [MPa·m0,5] 7
Coefficient of thermal expansion DIN EN 821-1
20°C - 500°C α [10-6/K] 2.0
500°C - 1000°C α [10-6/K] 4.0
Specific heat at 20°C DIN EN 821-3 cp [J/g K] 0.7
Thermal conductivity at 20°C DIN EN 821-2 λ [W/m K] 25
Thermal stress parameters calculated
R1 = σB·(1-ν) / (α·E) [K] 875
R2 = R1·λ [W/mm] 22
Specific electrical
resistance at 20°C
ρ [Ω cm] >1011