Boron Nitride
Material properties	Norm	Symbol / Unit	MYCROSINT® HD	MYCROSINT® S		MYCROSINT® CD
Crystalline phases			hex. BN	hex. BN		hex. BN
Binder phase / Binder type			<1%B2O3	4%B2O3		B2O3 + CaO
Orientation dependency			Isotropic	Anisotropic		Anisotropic
				⊥	II	⊥	II
Density (typical)	DIN EN 623-2	ρ [g/cm3]	1.96	2.07	2.07	1.97	1.97
Total porosity (calculated using theoretical density)	DIN EN 623-2	P [%]	<13	<7	<7	<12	<12
Brinell hardness	DIN EN ISO 6506-1	HBW 2.5/31.25	10	30	30	13	13
Young’s modulus	DIN EN 843-2	E [GPa]	23	35	30	30	25
Flexural strength	DIN EN 843-1	σB [MPa]	19	95	85	40	35
Weibull modulus	DIN EN 843-1
Compressive strength	AAW/ AC-R-302-03	σD [MPa]	36	105	125	50	55
Coefficient of thermal expansion	DIN EN 821-1			Thermal expansion behavior: nonlinear, residual elonation after cooling; CTE given indication only
20°C - 500°C		α [10-6/K]	-1	1	2	-1	-1
500°C - 1000°C		α [10-6/K]	0.5	1	2	1.5	2
1000°C - 1500°C		α [10-6/K]	2.5	1	5	3	4
Specific heat at 20°C	DIN EN 821-3	Cp [J/gK]	0.61	0.6	0.6	0.58	0.58
Thermal conductivity at 20°C	DIN EN 821-2	λ [W/mK]	25	40	25	35	35
Maximum temperature of use (oxidizing/inert atmosphere)		[°C]	900/1800	1000/ 1500	1000/ 1500	1100/ 1500	1100/ 1500
Specific electrical resistance at 20°C	DIN EN 50359	ρ [Ωcm]	>1012	>1012	>1012	>1012	>1012

			Boron Nitride
Material properties	Norm	Symbol / Unit	MYCROSINT® SO20		MYCROSINT® SO43		MYCROSINT® O40
Crystalline phases			BN+ZrO2+SiC		BN+ZrO2+SiC		BN+ZrO2
Binder phase / Binder type							2%B2O3
Orientation dependency			Anisotropic		Anisotropic		Anisotropic
			⊥	II	⊥	II	⊥	II
Density (typical)	DIN EN 623-2	ρ [g/cm3]	2.3	2.3	2.92	2.92	2.82	2.82
Total porosity (calculated using theoretical density)	DIN EN 623-2	P [%]	10	10	<6	<6	<6	<6
Brinell hardness	DIN EN ISO 6506-1	HBW 2.5/31.25	30	30	85	85	63	63
Young’s modulus	DIN EN 843-2	E [GPa]	35	20	45	30	45	25
Flexural strength	DIN EN 843-1	σB [MPa]	70	40	120	80	120	80
Weibull modulus	DIN EN 843-1
Compressive strength	AAW/ AC-R-302-03	σD [MPa]	85	100	175	175	185	185
Coefficient of thermal expansion	DIN EN 821-1		Thermal expansion behavior: nonlinear, residual elonation after cooling; CTE given indication only
20°C - 500°C		α [10-6/K]	0.5	4.6	2	8	2	6
500°C - 1000°C		α [10-6/K]	1.9	6.6	4	9	3.5	9
1000°C - 1500°C		α [10-6/K]	0.5	2.2	1.4	4.5	1.5	8
Specific heat at 20°C	DIN EN 821-3	Cp [J/gK]	0.6	0.6	0.5	0.5	0.5	0.5
Thermal conductivity at 20°C	DIN EN 821-2	λ [W/mK]	45	25	40	30	30	20
Maximum temperature of use (oxidizing/inert atmosphere)		[°C]	1100/ 1800	1100/ 1800	1100/ 1800	1100/ 1800	1100/ 1800	1100/ 1800
Specific electrical resistance at 20°C	DIN EN 50359	ρ [Ωcm]	>1012	>1012	>1012	>1012	>1012	>1012