EKaslice® ELECTROLESS NICKEL COMPOSITES SAW-WIRE COATING FOR THE SEMICONDUCTOR INDUSTRY
Sawing technology is used as an worldwide industry standard for production of silicon semiconductor wafes and sapphire semiconductor wafes. ESK’s EKaslice® makes an essential contribution to this, while also supporting
- continuous increases in wafer diameters
- shorter sawing times
- reduced cutting waste
- together with increased tool service lives
Sawing wire coatings of EKaslice® electroless nickel composites are available to the semiconductor industry in various wire diameters, wire lengths and layer thicknesses to suit any particular application.