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Electroless nickel composites saw-wire coating, semiconductor industry

EKaslice ELECTROLESS NICKEL COMPOSITES SAW-WIRE COATING FOR THE SEMICONDUCTOR INDUSTRY

Sawing technology is used as an worldwide industry standard for production of silicon semiconductor wafes and sapphire semiconductor wafes. ESK’s EKaslice makes an essential contribution to this, while also supporting

  • continuous increases in wafer diameters
  • shorter sawing times
  • reduced cutting waste
  • together with increased tool service lives 

Applications

Sawing wire coatings of EKaslice electroless nickel composites are available to the semiconductor industry in various wire diameters, wire lengths and layer thicknesses to suit any particular application.